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Low temperature glue/polyimide/PMI/polyurethane/heat resistant coating thermal insulation device

Temperature resistance: -260℃~300℃<br> Density: ≤40kg/m³<br> Thermal conductivity: 0.025~0.03W/mK<br> Tensile strength: 0.2~0.24MPa

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Keyword： Low temperature glue/polyimide/PMI/polyurethane/heat resistant coating thermal insulation device

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